New Technique Enables Seamless Integration of 2D Materials into Electronic Devices
MIT Researchers Develop Method to Overcome Challenges of Integrating Ultrathin 2D Materials Two-dimensional (2D) materials have the potential to revolutionize the field of electronics with their unique properties. However, integrating these ultrathin materials into devices has proven to be a major challenge due to their susceptibility to damage during conventional fabrication techniques. In a breakthrough…